Future of the Thermal Management – Thercon-LHP Water-Free
Solutions for HPC Cooling
SessionSystem Cooling
Presenter
Event Type
Exhibitor Forum
TimeThursday, November 16th10:30am -
11am
Location503-504
DescriptionLoop Heat Pipe is a two-phase heat-transfer device for
providing an effective thermal link between a heat
source and a heat sink in cooling systems for HPC.
Vaporization and condensation of working fluid
circulating inside the loop of tubes provides heat
transfer and capillary forces serve as a driving
mechanism. Capillary structure acts as a pump without
moving parts providing high reliability.
LHP heat transfer technology enables a range of water free cooling solutions for different electronic components like CPU, memory, GPU. Developed for high heat load applications in particular for HPC, they are easily adaptable and work without electric energy consumption.
LHP conception allows a wide variety of different design, which essentially extends the application fields and performance capabilities. LHP leave behind conventional cooling systems due to higher heat-transfer ability, compactness and flexibility. Technology improves productivity, lowers energy consumption, and provides high component density
LHP heat transfer technology enables a range of water free cooling solutions for different electronic components like CPU, memory, GPU. Developed for high heat load applications in particular for HPC, they are easily adaptable and work without electric energy consumption.
LHP conception allows a wide variety of different design, which essentially extends the application fields and performance capabilities. LHP leave behind conventional cooling systems due to higher heat-transfer ability, compactness and flexibility. Technology improves productivity, lowers energy consumption, and provides high component density
